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 MC33275, NCV33275 300 mA, Low Dropout Voltage Regulator
The MC33275 series are micropower low dropout voltage regulators available in a wide variety of output voltages as well as packages, DPAK, SOT-223, and SOP-8 surface mount packages. These devices feature a very low quiescent current and are capable of supplying output currents up to 300 mA. Internal current and thermal limiting protection are provided by the presence of a short circuit at the output and an internal thermal shutdown circuit. The MC33275 is available as a MC33375 which includes an On/Off control. Due to the low input-to-output voltage differential and bias current specifications, these devices are ideally suited for battery powered computer, consumer, and industrial equipment where an extension of useful battery life is desirable.
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LOW DROPOUT MICROPOWER VOLTAGE REGULATOR
GND
4 4
275xx ALYWW
1 2 3
* Low Quiescent Current (125 mA) * Low Input-to-Output Voltage Differential of 25 mV at IO = 10 mA, * * *
and 260 mV at IO = 300 mA Extremely Tight Line and Load Regulation Stable with Output Capacitance of only 0.33 mF for 2.5 V Output Voltage Internal Current and Thermal Limiting
1 3
PLASTIC DT SUFFIX CASE 369A
Vin GND Vout
GND
4
4 1
ALYW 275xx
1 2 3
Simplified Block Diagram
Vin Vout
3
Vin PLASTIC ST SUFFIX CASE 318E 1 Input
GND
Vout
Thermal & Anti-sat Protection Rint
8 Output 275xx ALYW GND GND N/C
8 1
GND GND N/C
1.23 V V. Ref. 54 K GND This device contains 41 active transistors
Pins 4 and 5 Not Connected PLASTIC D SUFFIX CASE 751 275 xx A L Y W, WW = Specific Device Code = Voltage Version = Assembly Location = Wafer Lot = Year = Work Week
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet.
(c) Semiconductor Components Industries, LLC, 2003
1
October, 2003 - Rev. 11
Publication Order Number: MC33275/D
MC33275, NCV33275
MAXIMUM RATINGS (TA = 25C, for min/max values TJ = -40C to +125C)
Rating Input Voltage Power Dissipation and Thermal Characteristics TA = 25C Maximum Power Dissipation Case 751 (SOP-8) D Suffix Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case Case 369A (DPAK) DT Suffix Thermal Resistance, Junction-to-Air Thermal Resistance, Junction-to-Case Case 318E (SOT-223) ST Suffix Thermal Resistance, Junction-to-Air Thermal Resistance, Junction-to-Case Output Current Maximum Junction Temperature Operating Junction Temperature Range Storage Temperature Range Symbol VCC Value 13 Unit Vdc
PD RqJA RqJC RqJA RqJC RqJA RqJC IO TJ TJ Tstg
Internally Limited 160 25 92 6.0 245 15 300 150 - 40 to +125 - 65 to +150
W C/W C/W C/W C/W C/W C/W mA C C C
ELECTRICAL CHARACTERISTICS (CL = 1.0 mF, TA = 25C, for min/max values TJ = -40C to +125C, Note 1)
Characteristic Output Voltage 2.5 V Suffix 3.0 V Suffix 3.3 V Suffix 5.0 V Suffix 2.5 V Suffix 3.0 V Suffix 3.3 V Suffix 5.0 V Suffix Line Regulation Load Regulation Dropout Voltage IO = 10 mA IO = 100 mA IO = 250 mA IO = 300 mA Ripple Rejection (120 Hz) Output Noise Voltage CL = 1 mF CL = 200 mF IO = 0 mA to 250 mA TA = 25C, Vin = [VO + 1] V Symbol VO 2.475 2.970 3.267 4.950 2.450 2.940 3.234 4.900 Regline Regload Vin - VO TJ = -40C to +125C - - - - - Vn IO = 50 mA (10 Hz to 100 kHz) - - 160 46 - - 65 25 115 220 260 75 100 200 400 500 - dB mVrm s - - 2.50 3.00 3.30 5.00 - - - - 2.0 5.0 2.525 3.030 3.333 5.05 2.550 3.060 3.366 5.100 10 25 mV mV mV Min Typ Max Unit Vdc
Vin = [VO + 1] V, 0 < IO < 100 mA 2% Tolerance from TJ = -40 to +125C
Vin = [VO + 1] V to 12 V, IO = 250 mA, All Suffixes TA = 25C Vin = [VO + 1] V, IO = 0 mA to 250 mA, All Suffixes TA = 25C
Vin(peak-peak) = [VO + 1.5] V to [VO + 5.5] V
CURRENT PARAMETERS
Characteristic Quiescent Current ON Mode Quiescent Current ON Mode SAT 2.5 V Suffix 3.0 V Suffix 3.3 V Suffix 5.0 V Suffix Current Limit Vin = [VO + 1] V, IO = 0 mA Vin = [VO - 0.5] V, IO = 0 mA, Note 2 Symbol IQ IQ - - - - Vin = [VO + 1] V, VO Shorted ILIMIT - 1100 1500 1500 1500 450 1500 2000 2000 2000 - mA Min - Typ 125 Max 200 Unit mA mA
THERMAL SHUTDOWN
Characteristic Thermal Shutdown Symbol - Min - Typ 150 Max - Unit C
1. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. 2. Quiescent Current is measured where the PNP pass transistor is in saturation. Vin = [VO - 0.5] V guarantees this condition. 3. NCV prefix is qualified for automotive use.
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MC33275, NCV33275
DEFINITIONS Load Regulation - The change in output voltage for a change in load current at constant chip temperature. Dropout Voltage - The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100 mV below its nominal value (which is measured at 1.0 V differential), dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Output Noise Voltage - The RMS AC voltage at the output with a constant load and no input ripple, measured over a specified frequency range. Maximum Power Dissipation - The maximum total dissipation for which the regulator will operate within specifications. Quiescent Current - Current which is used to operate the regulator chip and is not delivered to the load. Line Regulation - The change in output voltage for a change in the input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Maximum Package Power Dissipation - The maximum package power dissipation is the power dissipation level at which the junction temperature reaches its maximum value i.e. 150C. The junction temperature is rising while the difference between the input power (VCC X ICC) and the output power (Vout X Iout) is increasing. Depending on ambient temperature, it is possible to calculate the maximum power dissipation and so the maximum current as following:
T -T Pd + J A R qJA
The maximum operating junction temperature TJ is specified at 150C, if TA = 25C, then PD can be found. By neglecting the quiescent current, the maximum power dissipation can be expressed as:
I out + P D V - Vout CC
The thermal resistance of the whole circuit can be evaluated by deliberately activating the thermal shutdown of the circuit (by increasing the output current or raising the input voltage for example). Then you can calculate the power dissipation by subtracting the output power from the input power. All variables are then well known: power dissipation, thermal shutdown temperature (150C for MC33275) and ambient temperature.
R T -T +J A qJA P D
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MC33275, NCV33275
7 6 Vin , INPUT VOLTAGE (V) 5 4 50 3 2 1 0 0 20 40 60 80 100 120 140 160 180 200 TIME (mS) 0 Vout -50 TA = 25 C CL = 0.47 mF IL = 10 mA Vout = 3.3 V Vin 200 OUTPUT VOLTAGE CHANGE (mV) 150 100 7 TA = 25 C 6 CL = 33 mF IL = 10 mA 5 Vout = 3.3 V 4 3 2 1 0 0 50 100 TIME (mS) 150 200 Vout Vin 70 OUTPUT VOLTAGE CHANGE (mV) 60 50 40 30 20 10 0
Vin , INPUT VOLTAGE (V)
-10 -20
-100
Figure 1. Line Transient Response
Figure 2. Line Transient Response
300 200 100 LOAD CURRENT (mA) 0 -100 -200 -300 -400 CL = 1.0 mF Vout = 3.3 V -500 TA = 25 C -600 Vin = 4.3 V -700 0 50 100 Vout CHANGE LOAD CURRENT
1.0 0.8 OUTPUT VOLTAGE CHANGE (V) 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 150 200 250 300 350 -1.0 400 LOAD CURRENT (mA)
350 250 150 50 -50 -150 -250 -350 -450 -550 -650 -750 0 50 100 150 200 250 300 -0.16 -0.01 0.14
OUTPUT VOLTAGE CHANGE (V)
LOAD CURRENT
0.09 0.04
Vout CHANGE
CL = 33.0 mF Vout = 3.3 V TA = 25 C Vin = 4.3 V
-0.06 -0.11
TIME (mS)
TIME (mS)
Figure 3. Load Transient Response
Figure 4. Load Transient Response
3.5 3.0 2.5 IL = 250 mA 2.0 1.5 1.0 0.5 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 INPUT VOLTAGE (V) DROPOUT VOLTAGE (mV) OUTPUT VOLTAGE (V) IL = 1 mA
300 250 200 150 100 50 0 1 10 100 1000 IO, OUTPUT CURRENT (mA)
Figure 5. Output Voltage versus Input Voltage
Figure 6. Dropout Voltage versus Output Current
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MC33275, NCV33275
300 250 200 Ignd (mA) 150 100 50 0 -40 IL = 250 mA IL = 100 mA 12 10 8 6 4 IL = 100 mA IL = 10 mA 0 25 TEMPERATURE (C) 85 2 IL = 50 mA 0 0 1 2 3 4 Vin (VOLTS) 5 6 7 8 IL = 300 mA
DROPOUT VOLTAGE (mV)
IL = 300 mA
Figure 7. Dropout Voltage versus Temperature
Figure 8. Ground Pin Current versus Input Voltage
8 7 6 Ignd (mA) 5 4 3 2 1 0 -40 -20 0 20 40 60 80 IL = 50 mA 100 120 140 IL = 100 mA Vout (VOLTS) IL = 250 mA
2.5 2.495 2.49 2.485 2.48 2.475 2.47 -40 IO = 0
IO = 250 mA
0
25 TEMPERATURE (C)
85
TA (C)
Figure 9. Ground Pin Current versus Ambient Temperature
Figure 10. Output Voltage versus Ambient Temperature (Vin = Vout1 +1V)
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MC33275, NCV33275
2.5 2.495 2.49 Vout (VOLTS) 2.485 2.48 2.475 2.47 2.465 -40 0 TEMPERATURE (C) 25 85 IO = 250 mA IO = 0
Figure 11. Output Voltage versus Ambient Temperature (Vin = 12 V)
70 60 IL = 10 mA 50 IL = 1 mA dB dB 40 30 20 10 0 0.1 1 FREQUENCY (kHz) 10 100
70 60 50 40 30 20 10 0 0.1 1 FREQUENCY (kHz) 10 100 IL = 250 mA IL = 100 mA
Figure 12. Ripple Rejection
Figure 13. Ripple Rejection
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MC33275, NCV33275
APPLICATIONS INFORMATION
Vout
Vin MC33275-XX Cin Cout
LOAD
GND
Figure 14. Typical Application Circuit
ESR (ohm)
The MC33275 regulators are designed with internal current limiting and thermal shutdown making them user-friendly. Figure 14 is a typical application circuit. The output capability of the regulator is in excess of 300 mA, with a typical dropout voltage of less than 260 mV. Internal protective features include current and thermal limiting.
EXTERNAL CAPACITORS
100 Vout = 3.0 V Cout = 1.0 mF Cin = 1.0 mF 10 Stable Region 1.0
These regulators require only a 0.33 mF (or greater) capacitance between the output and ground for stability for 2.5 V, 3.0 V, and 3.3 V output voltage options. Output voltage options of 5.0 V require only 0.22 mF for stability. The output capacitor must be mounted as close as possible to the MC33275. If the output capacitor must be mounted further than two centimeters away from the MC33275, then a larger value of output capacitor may be required for stability. A value of 0.68 mF or larger is recommended. Most type of aluminum, tantalum, or multilayer ceramic will perform adequately. Solid tantalums or appropriate multilayer ceramic capacitors are recommended for operation below 25C. An input bypass capacitor is recommended to improve transient response or if the regulator is connected to the supply input filter with long wire lengths, more than 4 inches. This will reduce the circuit's sensitivity to the input line impedance at high frequencies. A 0.33 mF or larger tantalum, mylar, ceramic, or other capacitor having low internal impedance at high frequencies should be chosen. The bypass capacitor should be mounted with shortest possible lead or track length directly across the regulator's input terminals. Figure 15 shows the ESR that allows the LDO to remain stable for various load currents.
0.1 0 50 100 150 200 250 300 LOAD CURRENT (mA)
Figure 15. ESR for Vout = 3.0V Applications should be tested over all operating conditions to insure stability. THERMAL PROTECTION
Internal thermal limiting circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated, typically at 150C, the output is disabled. There is no hysteresis built into the thermal protection. As a result the output will appear to be oscillating during thermal limit. The output will turn off until the temperature drops below the 150C then the output turns on again. The process will repeat if the junction increases above the threshold. This will continue until the existing conditions allow the junction to operate below the temperature threshold.
Thermal limit is not a substitute for proper heatsinking.
The internal current limit will typically limit current to 450 mA. If during current limit the junction exceeds 150C, the thermal protection will protect the device also. Current limit is not a substitute for proper heatsinking.
OUTPUT NOISE
In many applications it is desirable to reduce the noise present at the output. Reducing the regulator bandwidth by increasing the size of the output capacitor will reduce the noise on the MC33275.
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MC33275, NCV33275
180 RqJA, THERMAL RESISTANCE, JUNCTION-TO-AIR (CW) 160 140 120 100 80 RqJA 60 0 5.0 Minimum Size Pad 1.6 PD(max) for TA = 50C 2.0 oz. Copper L L 1.4 1.2 1.0 0.8 0.6 0.4 30 PD, MAXIMUM POWER DISSIPATION (W) PD, MAXIMUM POWER DISSIPATION (W) 3.2 PD(max) for TA = 50C 2.8 2.4 Graph Represents Symmetrical Layout 2.0 L RqJA 50 30 0 10 20 1.6 1.2 0.8 0.4
10 15 20 25 L, LENGTH OF COPPER (mm)
Figure 16. SOT-223 Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length
100 RqJA, THERMAL RESISTANCE, JUNCTION-TO-AIR (CW) 90
PD(max) for TA = 50C 1.4
70 60 50
Minimum Size Pad
L
RqJA 40 0 5.0 10 15 20
L, LENGTH OF COPPER (mm)
Figure 17. DPAK Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length
R JA, THERMAL RESISTANCE, JUNCTION-TO-AIR ( C/W)
170 150 130 110 90 70
L, LENGTH OF COPPER (mm)
Figure 18. SOP-8 Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length
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IIIIIII IIIIIII IIIIIII
2.0 oz. Copper L
30
III III III III
80
2.0 oz. Copper L
III III III
25 40
1.6
1.2 1.0 0.8 0.6
0.4 30
3.0 mm
50
MC33275, NCV33275
ORDERING INFORMATION
Operating Temperature Range, Tolerance
Device MC33275DT-2.5RK MC33275ST-2.5T3 MC33275D-2.5R2 MC33275DT-3.0RK MC33275ST-3.0T3 MC33275D-3.0R2 MC33275DT-3.3RK MC33275ST-3.3T3 MC33275D-3.3R2 MC33275DT-5.0RK MC33275ST-5.0T3 NCV33275ST-5.0T3 MC33275D-5.0R2
Type 2.5 V (Fixed Voltage)
Case 369A 318E 751-5 369A
Package DPAK SOT-223 SOP-8 DPAK SOT-223 SOP-8 DPAK SOT-223 SOP-8 DPAK SOT-223 SOT-223 SOP-8
3.0 V (Fixed Voltage)
1% Tolerance at TA = 25 C 25C
318E 751-5 369A
3.3 V (Fixed Voltage)
2% Tolerance at TJ from -40 to +125 C +125C
318E 751-5 369A
5.0 V (Fixed Voltage)
318E 318E 751-5
DEVICE MARKING
Device MC33275 MC33275 MC33275 MC33275 Version 2.5V 3.0V 3.3V 5.0V Marking (1st line) 27525 27530 27533 27550
TAPE AND REEL SPECIFICATIONS
Device MC33275DT MC33275D MC33275S Reel Size 13" 13" 13" Tape Width 16mm embossed tape 12mm embossed tape 12mm embossed tape Quantity 2500 units 2500 units 4000 units
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MC33275, NCV33275
PACKAGE DIMENSIONS
ST SUFFIX PLASTIC PACKAGE CASE 318E-04 (SOT-223) ISSUE K
A F
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
4
S
1 2 3
B
D L G J C 0.08 (0003) H M K
INCHES DIM MIN MAX A 0.249 0.263 B 0.130 0.145 C 0.060 0.068 D 0.024 0.035 F 0.115 0.126 G 0.087 0.094 H 0.0008 0.0040 J 0.009 0.014 K 0.060 0.078 L 0.033 0.041 M 0_ 10 _ S 0.264 0.287
MILLIMETERS MIN MAX 6.30 6.70 3.30 3.70 1.50 1.75 0.60 0.89 2.90 3.20 2.20 2.40 0.020 0.100 0.24 0.35 1.50 2.00 0.85 1.05 0_ 10 _ 6.70 7.30
SCALE 1:1 -X- A
8 5
D SUFFIX PLASTIC PACKAGE CASE 751-07 SOIC-8 NB ISSUE AA
B
1 4
S
0.25 (0.010)
M
Y
M
-Y- G C -Z- H D 0.25 (0.010)
M SEATING PLANE
K
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751-01 THRU 751-06 ARE OBSOLETE. NEW STANDARD IS 751-07. MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244
N
X 45 _
0.10 (0.004)
M
J
ZY
S
X
S
DIM A B C D G H J K M N S
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MC33275, NCV33275
PACKAGE DIMENSIONS
DT SUFFIX PLASTIC PACKAGE CASE 369A-13 (DPAK) ISSUE AB
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 0.235 0.250 0.250 0.265 0.086 0.094 0.027 0.035 0.033 0.040 0.037 0.047 0.180 BSC 0.034 0.040 0.018 0.023 0.102 0.114 0.090 BSC 0.175 0.215 0.020 0.050 0.020 --- 0.030 0.050 0.138 --- MILLIMETERS MIN MAX 5.97 6.35 6.35 6.73 2.19 2.38 0.69 0.88 0.84 1.01 0.94 1.19 4.58 BSC 0.87 1.01 0.46 0.58 2.60 2.89 2.29 BSC 4.45 5.46 0.51 1.27 0.51 --- 0.77 1.27 3.51 ---
-T- B V R
4
SEATING PLANE
C E
A S
1 2 3
Z U
K F L D G
2 PL
J H 0.13 (0.005) T
DIM A B C D E F G H J K L R S U V Z
M
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MC33275, NCV33275
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
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MC33275/D


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